Source Photonics Announce the Product Availability of 400G/800G 2PIC Immersion Liquid Cooling Solutions with Live Demonstration at ECOC 2024
The product offerings of 400G/800G 2PIC immersive transceivers represent a key milestone to facilitate immersion cooling for its big moment in the Al and HPC data centers
West Hills, CA and Frankfurt, Germany – September 23, 2024, at the 50th European Conference on Optical Communication (ECOC) 2024 held in Frankfurt, Germany, Source Photonics, the world’s leading provider of optical connection solutions for AI clusters and cloud data centers, took the lead in releasing 800G DR8/DR8+ and 400G DR4/DR4+ immersion liquid-cooled optical transceiver series products and conduct live demonstration for industry first production shipping of 800G DR8 OSFP and 400G DR4 QSFP112 suitable for single or two phase immersion cooling (2PIC). This expands the product portfolio for single mode (SMF) 400/800G space to address a new emerging AI data center market for optical modules operated in environments using immersion cooling for efficient power saving and help further reduce the energy consumption of ultra-high performance AI computing centers and hyperscale data centers.
FIG.1 Source Photonics 800G/400G Immersion Liquid Cooled Optical Modules
In the wave of AI technological revolution, the AI/ML datacenter optics have been driven by lower cost per bit, liquid cooling technology is becoming a key infrastructure to support high-performance computing for achieving this goal. As GPU and CPU single-card power and server power density continue to rise, traditional air-cooled cooling technology has been difficult to meet the growing demand for heat dissipation. Common liquid cooling methods include cold plate type with running water pipes and immersion cooling using non-conductive liquid fluids. Immersion cooling is much power efficient over contact plate, more suitable for high power such as DSP chip cooling requirements, and so considered to be end game for liquid cooling solution in transceiver production. Immersion cooling approach is a growing market segment as it efficiently reduces the energy needed for cooling datacenter equipment and thus lowering the OPEX (operating expense). In the meantime, network equipment and associated sub-components operate under lower (optimal) operating temperatures which results in extended lifespan, enhance performance and lower failure rates. The existing non-hermetic design approaches like chip-on-board (COB) design of optical modules won’t be suitable for immersion cooling, so this requires to dramatically redesign the optical solution from scratch including the innovative PCBA design and redesign of Tx and Rx optical sub-assembly (TOSA & ROSA) with “Golden Box” hermetic packaging and properly sealing of any optical path exposed to open air with optical fiber pigtails, while still maintaining competitive cost advantages for achieving large volume of shipment targeting 400/800G interconnect applications. Source Photonics offer 400G/800G 2PIC transceivers for 4/8×106.25 Gb/s PAM4 optical interface and 4/8×106.25 Gb/s PAM4 electrical interface covering different reach and applications. 800G 2PIC DR8 (2xDR4) optical solution is in form of OSFP form factor covering 500m/2km, while 400G 2PIC DR4 optical solution is in form of QSFP112 form factor covering 500m/2km/10km. They are full compliance to CMIS 5.2, pass all GR-468 reliability tests and prove to work long lifespan under non-conductive liquid conditions that efficiently dissipates heat.
FIG.2 400G Immersion Liquid Cooling Optical Module Live Demo Block Diagram
Liquid cooling technology is accelerating the penetration of AI data centers with its advantages of low energy consumption, low total cost of ownership and small size. The market growth particularly by cloud service providers is driven by the increasing usage of immersion cooling as a cutting-edge method for managing heat in data centers. Immersion cooling is ready for its big moment in the data center. Per market analysis report, revenue for the liquid cooling market could top $7.8 billion by 2028, with a 50.4% compound annual growth rate (CAGR) from 2024 to 2028 during the forecast period.
Visit Us at ECOC 2024 exhibition!
Live demonstrations of the 400G 2PIC immersion cooling optical modules take place during the ECOC’24 exhibition, together with 1.6T, 800G, LPO/LRO, 10/25G/100G tunable and 25/50G PON high-performance optical transceiver solutions. Industry colleagues are welcome to visit booth #D67 for product details. Moreover, Source Photonics will also deliver a speech on 200G/Lane based 800G/1.6T optical transceivers at ECOC 2024.
The ECOC exhibition is taking place September 23-25, 2024.
About Source Photonics
Source Photonics is the world’s leading supplier of optical communication technology. It uses innovative and reliable technology to provide communication and data connection solutions with products widely used in AI and cloud data centers, metropolitan area networks and access networks. The company continues to develop next-generation solutions that provide customers with technology support for fast-growing global AI and cloud infrastructure, wireless communications, routing and fiber-to-the-home. Source Photonics’ global team of professional engineers and the company’s production R&D capabilities complement each other, including experts in the design of optical chips, optical components and modules. Source Photonics headquarter in West Hills, Los Angeles, CA and have its own product development and production bases in Chengdu, Sichuan, Changzhou, Jiangsu and Hsinchu, Taiwan. For 2023 annual report, Source Photonics is ranked the top 9th company among the global optical transceiver manufacturers. For recent 1Q quarter of 2024, Source Photonics take the 3rd place for shipping the most 400G optical modules in the world.
For more information about Source Photonics, please visit www.sourcephotonics.com.
Media Contact:
Jimmy Tate
Chief Business Officer
Phone: 818-773-9044
Email: sales@sourcephotonics.com